TSMC weighs second US chip hub in Texas as orders expand
Taiwan Semiconductor Manufacturing Co. is evaluating up to six wafer fabs in Dallas to serve American customers that generated 75.6% of its revenue in the first half of 2026.
Semiconductors & AI Hardware — Cross-border
RSSMemory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them. This page covers Cross-border.
TSMC plans to lift wafer foundry prices by 3% to 6% from 2027
Leading-edge 2-nanometer and 3-nanometer lines face the steepest increases as AI chip demand fills foundry capacity through 2030…
Synopsys certifies TSMC A14 EDA flows and tapes out 64G UCIe
The milestone expands 2-nanometer IP libraries for HBM4 memory and CoWoS packaging, locking fabless chipmakers into angstrom-era…
TSMC raises 2nm wafer target to 120,000 units as orders surge
The foundry lifted internal production goals by pulling forward capacity additions after Apple, Nvidia and three other anchor…
TSMC adds five packaging fabs in Chiayi to ease AI crunch
Taiwan's consultation for a 198.65-hectare Chiayi Science Park expansion clears the path for TSMC to construct five more advanced…
Vanguard and NXP open Singapore fab, weigh second chip plant
The $6.7 billion joint facility begins risk production at 40nm to 130nm nodes, offering Western automotive and AI hardware…
US and Japan coordinate on yttrium to counter China chip bottleneck
Bilateral talks target alternative refining and recycling channels after Chinese export curbs sent high-purity oxide prices from…
TSMC begins 1.4nm pilot wafer runs ahead of 2028 volume rampMembers
The foundry accelerated trial activity across Hsinchu and Taichung as it pre-empts rival nodes from Intel and Samsung for…
Nvidia locks up 37% of global HBM supply for AI accelerators
Surging procurement commitments reach $279 billion as the chip designer and cloud rivals absorb 85% of advanced DRAM lines,…
Taiwan breaks ground on TSMC packaging base to relieve CoWoS limits
The 88.7-hectare Baipu park will host tool-validation labs and supplier lines to ease advanced chip packaging constraints for AI…
TSMC and Samsung set High-NA EUV roadmaps for sub-2nm nodes
The foundries committed to ASML's next-generation lithography tools to bridge patterning limits, facing machine costs near $400…
AMD raises AI accelerator prices 10% on TSMC foundry costs
A planned fourth-quarter price adjustment covers enterprise Instinct accelerators and graphics cards while leaving consumer…
Taiwan clears TSMC fab site for sub-1.4nm chips at Longtan
The National Development Council approved an NT$95.6 billion layout across 104 hectares, granting Taiwan Semiconductor…
TSMC warns AI cannot solve physical barriers for 1.4nm chips
Co-Chief Operating Officer Y.J. Mii warns that automated design tools cannot bypass physical manufacturing limits as the foundry…
MediaTek debuts first 2nm mobile AP built on TSMC N2P node
The Dimensity 9600 Pro leapfrogs Qualcomm to secure TSMC nanosheet capacity, cutting multicore power consumption by up to 61%…
Pentagon backs Elmet with $450 million for tungsten capacity
The equity commitment funds domestic processing plants and a Nevada mine restart to curb reliance on China, which controls…
TSMC revenue rises 53% on AI demand to record NT$514 billion
The Taiwanese contract chipmaker reached NT$514.81 billion in August sales as advanced-node orders widened its global foundry…
AMD Reaffirms TSMC Alliance While Evaluating Rival Foundries
The chip designer projected an AI market of up to $3 trillion by 2030, keeping its wafer volume anchored at TSMC while conducting…
TSMC Reaffirms 2028 Target for 1.4nm Chips at Taichung Fab
Taiwan's park authority moves Fab 25 completion to April 2027, but the foundry giant leaves its commercial A14 manufacturing…
TSMC widens High-NA EUV alliance to build 12-inch photomasks by 2031
The foundry expanded supplier partnerships on Sept. 10 to establish larger reticle formats with ASML, targeting a 40% scanner…
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
TSMC Urges HBM Makers to Adopt X-Ray Friendly Chip Design for Advanced Packaging
Zhihua Zou told a Taipei forum that buried defects in multi-layer stacks require memory redesigns to prevent radiation damage…
Skytech opens TSMC-backed advanced process lab to speed chip tool verification
The joint Taiwan facility focuses on thin-film deposition tools, film modification techniques and chemical precursor screening…
East Asia materials makers accelerate diamond heat spreaders for 1000W AI chips
Advanced packaging suppliers across South Korea, Japan, and China target metal-diamond substrates and engineered TIMs to clear…