Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate front-end capacity limits.
Semiconductors & AI Hardware — Cross-border
RSSMemory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them. This page covers Cross-border.
Montage and Panmnesia validate CXL 3.1 memory silicon with Samsung and SK hynix
East Asian chip designers and memory manufacturers begin sampling PCIe 6.2 controllers and switches to scale AI server memory…
Foundries Standardize 300mm Silicon Photonics PDKs for AI Optical Interconnects
Commercial co-packaged optics platforms from TSMC, Samsung, and Tower target interconnect bottlenecks and thermal limits across…