
South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer architectures for domestic foundries.
Business•Industry•Policy Intelligence
Memory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them. This page covers South Korea.

The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer architectures for domestic foundries.

The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…