
GlobalFoundries signs $2B TSMC packaging deal for AI chips
The five-year agreement will produce silicon interposers at the Malta fab in New York starting in 2028 to ease CoWoS bottlenecks…
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Every EAB briefing that touches Samsung Electronics — capital spending, plants, M&A, earnings and policy exposure. 104 briefings.

The five-year agreement will produce silicon interposers at the Malta fab in New York starting in 2028 to ease CoWoS bottlenecks…

A 33% cell shrinkage gives China's memory champion a pathway to 50% higher bit density, putting pricing pressure on Samsung, SK…

Both memory makers are re-engineering package thermal paths and copper bonding to contain heat dissipation bottlenecks on…

A five-year agreement with GlobalFoundries establishes the first US manufacturing source for AI silicon interposers, challenging…

Average memory per humanoid will more than double to 39 gigabytes by 2030, shifting packaging requirements toward low-power LPDDR…

South Korean memory makers prepare 48-gigabyte stacks with hybrid bonding as AI accelerator thermal constraints and packaging…

The Japanese venture keeps its 2027 mass-production goal while enlisting Cadence and Synopsys to lower design barriers against…

The milestone marks 15 years of domestic manufacturing across Gyeonggi Province as local procurement surpassed 1 trillion won…

The five-year contract establishes domestic manufacturing in Malta, New York, for TSMC's CoWoS packaging ecosystem, with…

The partnership connects Oregon labs to Silicon Valley cleanrooms as foundry rivals TSMC and Samsung Electronics share toolmaker…

The Taiwanese foundry posted record third-quarter sales of NT$1.49 trillion ($46.7 billion), beating its guidance ceiling as Big…

Tesla and SpaceX will build and run the $16.8 billion Texas AI chip site directly, while Intel continues technical work on its…

Surging wafer equipment demand from Samsung Electronics and SK hynix puts Tokyo Electron's annual operating profit target within…

Lisa Su said in Seoul that the chipmaker is exploring production with Samsung Electronics, testing a hedge against single-foundry…

Parliamentary audit data shows departing specialists averaged 15.4 years of service before brief tenures at the Chinese memory…

Mature process nodes face 3% to 10% increases in January while chip designers prepare price hikes of up to double digits to…

The South Korean chipmaker pairs 4nm base dies with hybrid copper bonding to curb thermal resistance by 20% as Nvidia demands…

The Japanese supplier established the industry's first commercial finishing base for tin-based metal oxide resists to support…

Deliberations over an additional manufacturing site follow $265 billion committed to Arizona, as North American customers…

The electronics maker targets a 99.99% task success rate across more than 100 manufacturing plants, deferring general humanoid…

The South Korean factory equipment supplier deployed two dual-arm humanoids at its Asan center to automate logistics lines by…

A $110 million contract for SK hynix's Indiana packaging fab lifts the cleanroom engineering specialist's disclosed 2026 bookings…

The US memory maker will outsource its HBM4E base logic dies to TSMC's advanced node, targeting up to 30% higher bandwidth for…

The planned markups across client processors and accelerators pass through foundry price hikes of up to 10% as advanced packaging…