GlobalFoundries signs $2B TSMC packaging deal for AI chips
The five-year agreement will produce silicon interposers at the Malta fab in New York starting in 2028 to ease CoWoS bottlenecks…
Company watch
All companies →Nvidia
Every EAB briefing that touches Nvidia — capital spending, plants, M&A, earnings and policy exposure. 51 briefings.
- First seen
- August 28, 2026
- Latest
- October 12, 2026
- With a linked document
- 50 of 51
- Subject of the briefing
- 8
- Named as exposed
- 45
- Desks
- Semiconductors (36), Robotics (7), Batteries & EV (4), Trade & Policy (3), Analysis (1)
Samsung and SK hynix deploy cooling packaging on HBM4E chips
Both memory makers are re-engineering package thermal paths and copper bonding to contain heat dissipation bottlenecks on…
Korean battery makers secure non-FEOC LFP supply contracts
LG Energy Solution and Samsung SDI are locking in North American materials contracts before federal rules end transition relief…
TSMC widens CoWoS supply chain with $2 billion US interposer deal
A five-year agreement with GlobalFoundries establishes the first US manufacturing source for AI silicon interposers, challenging…
LG Energy Solution shifts battery output to AI data centers
South Korean battery makers accelerate grid storage production as Nvidia certifies containerized energy systems to cushion sudden…
Samsung and SK hynix Target Robot DRAM as Demand Multiplies
Average memory per humanoid will more than double to 39 gigabytes by 2030, shifting packaging requirements toward low-power LPDDR…
SK hynix and Samsung push 16-layer HBM4 as Nvidia caps Rubin at 12 dies
South Korean memory makers prepare 48-gigabyte stacks with hybrid bonding as AI accelerator thermal constraints and packaging…
GlobalFoundries agrees to build silicon interposers for TSMC in $2B deal
The five-year contract establishes domestic manufacturing in Malta, New York, for TSMC's CoWoS packaging ecosystem, with…
TSMC September revenue jumps 55% on booming AI chip orders
The Taiwanese foundry posted record third-quarter sales of NT$1.49 trillion ($46.7 billion), beating its guidance ceiling as Big…
Kawasaki Heavy unveils quadruped AI robot for shipyards in 2026
The four-legged machine navigates vertical hull plates using abdominal magnets to automate hazardous welding and inspection at…
TSMC raises foundry prices for fabless clients by up to 10% in 2027
Mature process nodes face 3% to 10% increases in January while chip designers prepare price hikes of up to double digits to…
Samsung revamps HBM thermal packaging to challenge TSMC supply lead
The South Korean chipmaker pairs 4nm base dies with hybrid copper bonding to curb thermal resistance by 20% as Nvidia demands…
US charges tech firm over $300M Nvidia chip exports to China
Earthmade Computer routed advanced A100 and H100 servers through Malaysia and Singapore before sending them to Hangzhou, exposing…
TSMC weighs Texas foundry campus to expand US chip capacity
Deliberations over an additional manufacturing site follow $265 billion committed to Arizona, as North American customers…
Kawasaki Heavy advances 2030 target for AI humanoid robots
The machinery maker plans to integrate domestic AI platform Noetra into its 30-kilogram payload Kaleido model, accelerating…
Micron taps TSMC for custom HBM4E memory, taking on SK hynix
The US memory maker will outsource its HBM4E base logic dies to TSMC's advanced node, targeting up to 30% higher bandwidth for…
Micron Cuts DRAM Lead of SK hynix to One Point on HBM Demand
The US chipmaker reached 24% of global DRAM revenue in the second quarter as SK hynix fell to 25%, testing Korean memory pricing…
Hanwha Ocean taps KIRO to develop shipyard humanoid robotsMembers
The state robotics institute will test physical AI and autonomous systems at the Geoje yard as South Korean shipbuilders race to…
TSMC weighs second US chip hub in Texas as orders expand
Taiwan Semiconductor Manufacturing Co. is evaluating up to six wafer fabs in Dallas to serve American customers that generated…
SK hynix validates HBM5 with TSMC on next-generation CoWoS
The South Korean chipmaker secured TSMC's partner award after completing thermal and electrical trials on eighth-generation…
TSMC plans to lift wafer foundry prices by 3% to 6% from 2027
Leading-edge 2-nanometer and 3-nanometer lines face the steepest increases as AI chip demand fills foundry capacity through 2030…
Synopsys certifies TSMC A14 EDA flows and tapes out 64G UCIe
The milestone expands 2-nanometer IP libraries for HBM4 memory and CoWoS packaging, locking fabless chipmakers into angstrom-era…
TSMC raises 2nm wafer target to 120,000 units as orders surge
The foundry lifted internal production goals by pulling forward capacity additions after Apple, Nvidia and three other anchor…
TSMC adds five packaging fabs in Chiayi to ease AI crunch
Taiwan's consultation for a 198.65-hectare Chiayi Science Park expansion clears the path for TSMC to construct five more advanced…