Business•Industry•Policy Intelligence
Memory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them.
East Asian chip designers and memory manufacturers begin sampling PCIe 6.2 controllers and switches to scale AI server memory bandwidth and reduce total cost of ownership.
Commercial co-packaged optics platforms from TSMC, Samsung, and Tower target interconnect bottlenecks and thermal limits across…
Japanese toolmakers secure process-of-record status on advanced logic pilot lines as backside power delivery doubles lithography…
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
Chemical suppliers modify spherical silica filler morphology and polymer matrices to counter extreme thermomechanical stress…
Domestic specialty producers scale distillation systems and validation protocols to supply 5N-grade fluorocarbons directly to…
DB HiTek and SK keyfoundry reallocate mature 200mm wafer capacity toward high-voltage automotive power management ICs to counter…
Chinese fabless designers are taping out custom RISC-V edge accelerators on SMIC 14nm lines to bypass advanced packaging…
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.
The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…
Domestic wafer manufacturers scale 12-inch polished and epitaxial shipments to supply local foundries, displacing imported…
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…
The Japanese toolmaker is qualifying high-selectivity dielectric etch platforms across South Korean and Japanese memory lines as…
Domestic memory fabricators and packaging houses deploy customized TSV tools and hybrid bonding to build localized high-bandwidth…
Chinese chipmakers expand procurement of domestic etching and lithography tools as foundries push to insulate production lines…
Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with…