Samsung deploys TSMC-tested photonics probers for CPO push
The South Korean chipmaker deployed FormFactor and MPI probe stations to inspect optical wafers internally, aligning with TSMC standards to speed co-packaged optics commercialization.
Semiconductors & AI Hardware
RSSMemory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them.
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
Samsung denies Chinese tool testing as US tightens fab controls
South Korean memory makers face annual US export reviews for their Chinese fabs as Washington curbs equipment servicing and…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
Air Products commits record capital to South Korea chip fabs
The industrial gas supplier filed plans with Seoul on Sept. 4 to build dedicated Pyeongtaek facilities for Samsung Electronics,…
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…
US chip suppliers commit $2 billion to South Korea semiconductor supply chain
Air Products, Axcelis, Corning and Pacifico Energy signed direct investment filings in Washington to expand fab tooling,…
TSMC Urges HBM Makers to Adopt X-Ray Friendly Chip Design for Advanced Packaging
Zhihua Zou told a Taipei forum that buried defects in multi-layer stacks require memory redesigns to prevent radiation damage…
Korea presses US for equal chip tariff terms as Lutnick warns of import levies
Trade Minister Kim Jung-kwan said Seoul is negotiating to ensure domestic chipmakers face terms no worse than competitors under…
ASML expands Japan workforce to 700 to support Rapidus 2nm and TSMC fabs
The Dutch lithography supplier plans a 40% headcount increase by 2030 to install and maintain EUV equipment for cutting-edge…
KEPCO seeks $18 billion advance power bill payment from Samsung and SK hynix
The state utility wants five years of electricity fees paid upfront to fund transmission lines for the Yongin semiconductor…
POSCO Chairman Urges Australia Critical Minerals Alliance to Diversify SupplyMembers
Chang In-hwa proposed pairing Australian raw materials with South Korean refining during a bilateral summit in Adelaide as POSCO…
CXMT starts pilot HBM3E production as China accelerates AI chip self-reliance
Chinese memory maker CXMT is testing fifth-generation high-bandwidth memory with domestic chip designers following United States…
Skytech opens TSMC-backed advanced process lab to speed chip tool verification
The joint Taiwan facility focuses on thin-film deposition tools, film modification techniques and chemical precursor screening…
LG taps Samsung Foundry for appliance AI chips under Korean state project
The 31 billion won development consortium marks a rare shift by LG away from TSMC as Seoul backs domestic edge processor supply…
Kyocera opens 68 billion yen Nagasaki plant for AI chip packaging
The Japanese components maker completed construction of its Isahaya site on Sept.
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
TSMC and Japanese Auto Suppliers Scale 28nm BCD Power Chip ProductionMembers
Automotive suppliers integrate high-voltage power management silicon into domestic 300mm foundry lines to secure electrified…
South Korean toolmakers advance glass substrate TGV laser drillers to volume lines
Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.
Japanese photoresist makers validate metal oxide resist lines for High-NA EUV chipmaking
JSR, TOK and Adeka advance inorganic patterning materials as leading foundries test sub-2nm lines on ASML 0.55 NA scanners.
East Asia materials makers accelerate diamond heat spreaders for 1000W AI chips
Advanced packaging suppliers across South Korea, Japan, and China target metal-diamond substrates and engineered TIMs to clear…
Japan optical suppliers scale laser diodes and engines for AI co-packaged optics
Furukawa Electric and Sumitomo Electric expand continuous-wave laser output as data centers adopt external optical sources.
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Lasertec ships EUV pellicle defect inspection tools for sub-2nm chip production
Japanese metrology specialist Lasertec and Finland's Canatu integrate dedicated CNT pellicle inspection systems to secure…