LG taps Samsung Foundry for appliance AI chips under Korean state project
The 31 billion won development consortium marks a rare shift by LG away from TSMC as Seoul backs domestic edge processor supply chains.
Semiconductors & AI Hardware
RSSMemory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them.
Kyocera opens 68 billion yen Nagasaki plant for AI chip packaging
The Japanese components maker completed construction of its Isahaya site on Sept.
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
TSMC and Japanese Auto Suppliers Scale 28nm BCD Power Chip ProductionMembers
Automotive suppliers integrate high-voltage power management silicon into domestic 300mm foundry lines to secure electrified…
South Korean toolmakers advance glass substrate TGV laser drillers to volume lines
Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.
Japanese photoresist makers validate metal oxide resist lines for High-NA EUV chipmaking
JSR, TOK and Adeka advance inorganic patterning materials as leading foundries test sub-2nm lines on ASML 0.55 NA scanners.
East Asia materials makers accelerate diamond heat spreaders for 1000W AI chips
Advanced packaging suppliers across South Korea, Japan, and China target metal-diamond substrates and engineered TIMs to clear…
Japan optical suppliers scale laser diodes and engines for AI co-packaged optics
Furukawa Electric and Sumitomo Electric expand continuous-wave laser output as data centers adopt external optical sources.
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Lasertec ships EUV pellicle defect inspection tools for sub-2nm chip production
Japanese metrology specialist Lasertec and Finland's Canatu integrate dedicated CNT pellicle inspection systems to secure…
Montage and Panmnesia validate CXL 3.1 memory silicon with Samsung and SK hynix
East Asian chip designers and memory manufacturers begin sampling PCIe 6.2 controllers and switches to scale AI server memory…
Foundries Standardize 300mm Silicon Photonics PDKs for AI Optical Interconnects
Commercial co-packaged optics platforms from TSMC, Samsung, and Tower target interconnect bottlenecks and thermal limits across…
Tokyo Electron qualifies BSPDN coater-developer tracks for sub-2nm fabs
Japanese toolmakers secure process-of-record status on advanced logic pilot lines as backside power delivery doubles lithography…
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…
Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
Japanese epoxy mold makers reformulate resins to tame warpage in 16-high memory
Chemical suppliers modify spherical silica filler morphology and polymer matrices to counter extreme thermomechanical stress…
Korea chemical suppliers expand fluorinated etching gas purification capacity
Domestic specialty producers scale distillation systems and validation protocols to supply 5N-grade fluorocarbons directly to…
Korea Foundries Shift 200mm Lines to Auto PMICs as EV Architectures Advance
DB HiTek and SK keyfoundry reallocate mature 200mm wafer capacity toward high-voltage automotive power management ICs to counter…
China RISC-V Chipmakers Tap Domestic 14nm Nodes for Industrial AI
Chinese fabless designers are taping out custom RISC-V edge accelerators on SMIC 14nm lines to bypass advanced packaging…
South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.
Samsung Foundry converts mature planar lines to automotive power chips
The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…
China expands 300mm silicon wafer capacity to cut reliance on Japanese suppliers
Domestic wafer manufacturers scale 12-inch polished and epitaxial shipments to supply local foundries, displacing imported…
Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…