Monday, August 31, 2026

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TSMC and Japanese Auto Suppliers Scale 28nm BCD Power Chip Production

Automotive suppliers integrate high-voltage power management silicon into domestic 300mm foundry lines to secure electrified vehicle supply chains.

A technician in a cleanroom suit holds a semiconductor wafer beside automated processing equipment during manufacturing operations. (AI-generated image)
A technician in a cleanroom suit holds a semiconductor wafer beside automated processing equipment during manufacturing operations. (AI-generated image)

Japan Advanced Semiconductor Manufacturing confirmed on Feb. 28, 2026, that it has integrated advanced power management processes into its 300-millimeter specialty wafer operations in Kumamoto Prefecture.

The foundry joint venture, majority-owned by Taiwan Semiconductor Manufacturing Co., manufactures specialty logic and power semiconductors on 28-nanometer and 22-nanometer process nodes for automotive tier-1 suppliers and industrial clients.

The documents behind this briefing are linked above. East Asia Brief produces its English text with AI assistance under human editorial review, and does not translate or republish other outlets' articles. See our methodology and AI policy. Spotted an error? Tell us.

KS

Kenji Sato

Japan bureau chief — Kenji Sato leads Japan coverage, with a focus on the semiconductor equipment and materials suppliers that sit upstream of every fab in the region.

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