Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers shift toward custom foundry base dies.
Semiconductors & AI Hardware — South Korea
RSSMemory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them. This page covers South Korea.
Air Products commits record capital to South Korea chip fabs
The industrial gas supplier filed plans with Seoul on Sept. 4 to build dedicated Pyeongtaek facilities for Samsung Electronics,…
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…
US chip suppliers commit $2 billion to South Korea semiconductor supply chain
Air Products, Axcelis, Corning and Pacifico Energy signed direct investment filings in Washington to expand fab tooling,…
Korea presses US for equal chip tariff terms as Lutnick warns of import levies
Trade Minister Kim Jung-kwan said Seoul is negotiating to ensure domestic chipmakers face terms no worse than competitors under…
KEPCO seeks $18 billion advance power bill payment from Samsung and SK hynix
The state utility wants five years of electricity fees paid upfront to fund transmission lines for the Yongin semiconductor…
POSCO Chairman Urges Australia Critical Minerals Alliance to Diversify SupplyMembers
Chang In-hwa proposed pairing Australian raw materials with South Korean refining during a bilateral summit in Adelaide as POSCO…
LG taps Samsung Foundry for appliance AI chips under Korean state project
The 31 billion won development consortium marks a rare shift by LG away from TSMC as Seoul backs domestic edge processor supply…
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
South Korean toolmakers advance glass substrate TGV laser drillers to volume lines
Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…
Korea chemical suppliers expand fluorinated etching gas purification capacity
Domestic specialty producers scale distillation systems and validation protocols to supply 5N-grade fluorocarbons directly to…
Korea Foundries Shift 200mm Lines to Auto PMICs as EV Architectures Advance
DB HiTek and SK keyfoundry reallocate mature 200mm wafer capacity toward high-voltage automotive power management ICs to counter…
South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
Samsung Foundry converts mature planar lines to automotive power chips
The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…