TSMC widens High-NA EUV alliance to build 12-inch photomasks by 2031
The foundry expanded supplier partnerships on Sept. 10 to establish larger reticle formats with ASML, targeting a 40% scanner…
Company watch
All companies →TSMC
Every EAB briefing that touches TSMC — capital spending, plants, M&A, earnings and policy exposure. 36 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 34 of 36
- Subject of the briefing
- 20
- Named as exposed
- 16
- Desks
- Semiconductors (32), Analysis (4)
Samsung opens Yokohama chip packaging lab to rival TSMC lead
The $280 million research site secures Japanese state subsidies to integrate domestic materials suppliers into Samsung's backend…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…
TSMC Urges HBM Makers to Adopt X-Ray Friendly Chip Design for Advanced Packaging
Zhihua Zou told a Taipei forum that buried defects in multi-layer stacks require memory redesigns to prevent radiation damage…
LG taps Samsung Foundry for appliance AI chips under Korean state project
The 31 billion won development consortium marks a rare shift by LG away from TSMC as Seoul backs domestic edge processor supply…
Japanese photoresist makers validate metal oxide resist lines for High-NA EUV chipmaking
JSR, TOK and Adeka advance inorganic patterning materials as leading foundries test sub-2nm lines on ASML 0.55 NA scanners.
EUV Materials Suppliers in Korea and Japan Advance High-Power CNT Pellicle Mass Testing
FST, Mitsui Chemicals, and LINTEC expand dedicated manufacturing capacity as advanced semiconductor fabs qualify carbon nanotube…
Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
High-purity hydrogen peroxide supply chains face regional bottlenecks across East Asian fabs [90 characters]
Semiconductor wafer manufacturers in South Korea, Taiwan, and Japan rely on localized ultra-pure chemical purification networks…
Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target
Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with…
Comparing East Asia Fab Subsidies Across Japan, Korea, and China
Capital matching rates, cash disbursement mechanisms, and infrastructure funding models diverge sharply across Tokyo, Seoul, and…