Samsung and SK hynix Target Robot DRAM as Demand Multiplies
Average memory per humanoid will more than double to 39 gigabytes by 2030, shifting packaging requirements toward low-power LPDDR…
Company watch
All companies →Micron Technology
Every EAB briefing that touches Micron Technology — capital spending, plants, M&A, earnings and policy exposure. 22 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 21 of 22
- Subject of the briefing
- 5
- Named as exposed
- 18
- Desks
- Semiconductors (21), Analysis (1)
Intel joins Applied Materials in $5 billion chip R&D hubMembers
The partnership connects Oregon labs to Silicon Valley cleanrooms as foundry rivals TSMC and Samsung Electronics share toolmaker…
Hanmi Semiconductor wins $18 million tool deal from Samsung
The 24.48 billion won order for substrate saw and inspection equipment marks the supplier's first major contract with a Samsung…
Micronex builds $9.5 million chip lead-frame plant in Sanand
The 500 million unit facility marks India's first domestic supplier for packaging backbones as Sanand expands into an outsourced…
Micron taps TSMC for custom HBM4E memory, taking on SK hynix
The US memory maker will outsource its HBM4E base logic dies to TSMC's advanced node, targeting up to 30% higher bandwidth for…
Micron Cuts DRAM Lead of SK hynix to One Point on HBM Demand
The US chipmaker reached 24% of global DRAM revenue in the second quarter as SK hynix fell to 25%, testing Korean memory pricing…
Samsung says HBM will take 30% of DRAM wafer capacity by 2027
The shift crowds out standard DDR5 output across shared lines, while research firm TrendForce projects average selling prices for…
SK hynix validates HBM5 with TSMC on next-generation CoWoS
The South Korean chipmaker secured TSMC's partner award after completing thermal and electrical trials on eighth-generation…
Nvidia locks up 37% of global HBM supply for AI accelerators
Surging procurement commitments reach $279 billion as the chip designer and cloud rivals absorb 85% of advanced DRAM lines,…
CXMT starts 5th-gen DRAM output, bypassing US tool controls
The Chinese chipmaker deployed deep ultraviolet quadruple patterning to reach an 11.95-nanometer half-pitch and began volume runs…
SK hynix subsidiary Solidigm weighs NAND fab in New York
The South Korean memory producer said Sept. 18 that no terms are settled, as Washington pressures foreign chipmakers to onshore…
Samsung Electronics opens HBM4 base die supply to rival TSMC for AI
The South Korean memory maker will offer customers external wafer fabrication alongside its internal 4nm lines as it prepares…
Hanmi Semiconductor Wins Tool Order for Musk's Terafab PlantMembers
The South Korean packaging toolmaker secures its first supply contract for Elon Musk's Texas AI fab, though formal regulatory…
DeepSeek cuts AI memory use 75%, rattling global chipmakers
The Chinese startup compressed key-value cache memory in its DeepSeek-V4.1-Flash model, erasing up to 3.5% of market value at…
CXMT beats SK hynix and Micron in DRAM margin at 87.59% gross rate
A second-quarter gross margin of 87.59% propelled the Chinese memory maker past foreign rivals as heavy domestic demand and…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…
TSMC Urges HBM Makers to Adopt X-Ray Friendly Chip Design for Advanced Packaging
Zhihua Zou told a Taipei forum that buried defects in multi-layer stacks require memory redesigns to prevent radiation damage…
CXMT starts pilot HBM3E production as China accelerates AI chip self-reliance
Chinese memory maker CXMT is testing fifth-generation high-bandwidth memory with domestic chip designers following United States…
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
High-purity hydrogen peroxide supply chains face regional bottlenecks across East Asian fabs [90 characters]
Semiconductor wafer manufacturers in South Korea, Taiwan, and Japan rely on localized ultra-pure chemical purification networks…
Tokyo Electron Deploys Cryogenic Etch Systems to Challenge US Grip on 3D NAND
The Japanese toolmaker is qualifying high-selectivity dielectric etch platforms across South Korean and Japanese memory lines as…