Intel joins Applied Materials in $5 billion chip R&D hubMembers
The partnership connects Oregon labs to Silicon Valley cleanrooms as foundry rivals TSMC and Samsung Electronics share toolmaker…
Company watch
All companies →Applied Materials
Every EAB briefing that touches Applied Materials — capital spending, plants, M&A, earnings and policy exposure. 10 briefings.
- First seen
- August 28, 2026
- Latest
- October 8, 2026
- With a linked document
- 9 of 10
- Subject of the briefing
- 2
- Named as exposed
- 8
- Desks
- Semiconductors (7), Analysis (1), Energy & Minerals (1), Robotics (1)
China yttrium export curbs squeeze Western chip toolmakers
Ultra-high purity yttrium oxide surged 140-fold to $850 a kilogram as plasma etch chamber coating shortages delay wafer fab tool…
Taiwan clears TSMC fab site for sub-1.4nm chips at Longtan
The National Development Council approved an NT$95.6 billion layout across 104 hectares, granting Taiwan Semiconductor…
SK hynix and foundries advance hybrid bonding for AI silicon in 2027
TSMC tasks Asian suppliers with developing five-micrometer microbumps while Samsung and SK hynix prepare direct copper…
Axcelis Invests $35 Million in South Korea Equipment Plant
The Massachusetts-based toolmaker will construct a 200,000-square-foot facility in Pyeongtaek to supply ion implanters directly…
Samsung denies Chinese tool testing as US tightens fab controls
South Korean memory makers face annual US export reviews for their Chinese fabs as Washington curbs equipment servicing and…
ASML expands Japan workforce to 700 to support Rapidus 2nm and TSMC fabs
The Dutch lithography supplier plans a 40% headcount increase by 2030 to install and maintain EUV equipment for cutting-edge…
Skytech opens TSMC-backed advanced process lab to speed chip tool verification
The joint Taiwan facility focuses on thin-film deposition tools, film modification techniques and chemical precursor screening…
Japan Linear Guide Makers Expand Ultra-Clean Units for 2nm Fab Robotics
THK, NSK, and IKO scale maintenance-free motion hardware and zero-outgassing stages as sub-3nm semiconductor fabs require…
Comparing East Asia Fab Subsidies Across Japan, Korea, and China
Capital matching rates, cash disbursement mechanisms, and infrastructure funding models diverge sharply across Tokyo, Seoul, and…