Samsung revamps HBM thermal packaging to challenge TSMC supply lead
The South Korean chipmaker pairs 4nm base dies with hybrid copper bonding to curb thermal resistance by 20% as Nvidia demands…
Company watch
All companies →Broadcom
Every EAB briefing that touches Broadcom — capital spending, plants, M&A, earnings and policy exposure. 5 briefings.
- First seen
- August 30, 2026
- Latest
- October 6, 2026
- With a linked document
- 5 of 5
- Subject of the briefing
- 2
- Named as exposed
- 3
- Desks
- Semiconductors (5)
TOPPAN and Broadcom open Singapore plant for AI substrates
The 95,000-square-meter facility in Jurong marks TOPPAN’s first overseas FC-BGA base and Broadcom’s push to secure critical…
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…