Sumitomo Bakelite expands Asian chip molding compound lines
New production lines in Suzhou and Singapore will double mold underfill capacity and triple granular compound output to supply…
Company watch
All companies →ASE Technology Holding
Every EAB briefing that touches ASE Technology Holding — capital spending, plants, M&A, earnings and policy exposure. 7 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 6 of 7
- Subject of the briefing
- 3
- Named as exposed
- 4
- Desks
- Semiconductors (6), Analysis (1)
Japan Prefectures Woo Taiwan Chip Vendors With Site Grants
Regional governments across Kyushu are preparing dedicated industrial parks to house supply chains feeding TSMC’s planned $17…
Foundry 2.0 Revenue Climbs 25%Members
Counterpoint Research said Sept. 29 that global Foundry 2.0 revenue expanded 25% year-on-year to a record $96.6 billion in the…
TSMC adds five packaging fabs in Chiayi to ease AI crunch
Taiwan's consultation for a 198.65-hectare Chiayi Science Park expansion clears the path for TSMC to construct five more advanced…
Taiwan breaks ground on TSMC packaging base to relieve CoWoS limits
The 88.7-hectare Baipu park will host tool-validation labs and supplier lines to ease advanced chip packaging constraints for AI…
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.