Intel joins Applied Materials in $5 billion chip R&D hub
The partnership connects Oregon labs to Silicon Valley cleanrooms as foundry rivals TSMC and Samsung Electronics share toolmaker research space to curb node costs.
Intel joined Applied Materials' $5 billion semiconductor research facility on Oct. 8, 2026, partnering with the toolmaker to accelerate advanced transistor architecture, power delivery interconnects and Foveros three-dimensional packaging for artificial intelligence processors.
The joint effort connects Intel's primary technology development campus in Hillsboro, Oregon, with the Equipment and Process Innovation and Commercialization Center, or EPIC Center, located in Sunnyvale, California.
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