TSMC widens CoWoS supply chain with $2 billion US interposer deal
A five-year agreement with GlobalFoundries establishes the first US manufacturing source for AI silicon interposers, challenging…
Company watch
All companies →Tokyo Electron
Every EAB briefing that touches Tokyo Electron — capital spending, plants, M&A, earnings and policy exposure. 23 briefings.
- First seen
- August 28, 2026
- Latest
- October 12, 2026
- With a linked document
- 16 of 23
- Subject of the briefing
- 5
- Named as exposed
- 20
- Desks
- Semiconductors (14), Trade & Policy (6), Robotics (2), Analysis (1)
Tokyo Electron nears 1 trillion yen profit on memory capex
Surging wafer equipment demand from Samsung Electronics and SK hynix puts Tokyo Electron's annual operating profit target within…
White House keeps chip export controls after Xi-Trump summit
Bilateral summit readouts carve out $30 billion in consumer goods for tariff relief, but U.S.
CXMT starts 5th-gen DRAM output, bypassing US tool controls
The Chinese chipmaker deployed deep ultraviolet quadruple patterning to reach an 11.95-nanometer half-pitch and began volume runs…
Taiwan clears TSMC fab site for sub-1.4nm chips at Longtan
The National Development Council approved an NT$95.6 billion layout across 104 hectares, granting Taiwan Semiconductor…
China Imposes Border Exit Bans for Dual-Use Export BreachesMembers
State Council Order No. 841 grants trade officials authority to block citizens from departing China indefinitely when tech…
US and Japan weigh $19 billion GlobalFoundries fab under tariff pact
Washington and Tokyo review funding for a US logic chip factory operated by GlobalFoundries as part of Japan's $550 billion…
TSMC revenue rises 53% on AI demand to record NT$514 billion
The Taiwanese contract chipmaker reached NT$514.81 billion in August sales as advanced-node orders widened its global foundry…
China confirms reciprocal tariff talks with US on $30B trade
Working-level negotiators seek to apply most-favored-nation duties to non-sensitive imports through a newly formed bilateral…
SK hynix and foundries advance hybrid bonding for AI silicon in 2027
TSMC tasks Asian suppliers with developing five-micrometer microbumps while Samsung and SK hynix prepare direct copper…
Samsung opens Yokohama chip packaging lab to rival TSMC lead
The $280 million research site secures Japanese state subsidies to integrate domestic materials suppliers into Samsung's backend…
Japan offers U.S. chip investment to win semiconductor tariff relief
Economy Minister Ryosei Akazawa met Commerce Secretary Howard Lutnick to protect Japanese chip suppliers using Tokyo's $550…
Skytech opens TSMC-backed advanced process lab to speed chip tool verification
The joint Taiwan facility focuses on thin-film deposition tools, film modification techniques and chemical precursor screening…
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
Tokyo Electron qualifies BSPDN coater-developer tracks for sub-2nm fabs
Japanese toolmakers secure process-of-record status on advanced logic pilot lines as backside power delivery doubles lithography…
Japan Linear Guide Makers Expand Ultra-Clean Units for 2nm Fab Robotics
THK, NSK, and IKO scale maintenance-free motion hardware and zero-outgassing stages as sub-3nm semiconductor fabs require…
South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target
Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with…
Naura and SMEE Accelerate Domestic Tool Shipments to Chinese Fabs
Chinese chipmakers expand procurement of domestic etching and lithography tools as foundries push to insulate production lines…
Tokyo Electron Deploys Cryogenic Etch Systems to Challenge US Grip on 3D NAND
The Japanese toolmaker is qualifying high-selectivity dielectric etch platforms across South Korean and Japanese memory lines as…
Comparing East Asia Fab Subsidies Across Japan, Korea, and China
Capital matching rates, cash disbursement mechanisms, and infrastructure funding models diverge sharply across Tokyo, Seoul, and…
Japan METI allocates clean power grid grants to anchor Hokkaido semiconductor hub
The Ministry of Economy, Trade and Industry will fund dedicated renewable transmission and substation assets to guarantee…
Daifuku expands cleanroom transport backlogs as Asian chipmakers accelerate fab builds
Surging orders for overhead hoist transport systems across Japanese, Taiwanese, and South Korean wafer fabs lift cleanroom…