Tesla Retains Terafab Control, Limiting TSMC to Site Leases
The initial $16.8 billion Texas project targets 1 terawatt of annual AI compute with Intel as process partner, while TSMC faces…
Company watch
All companies →Intel
Every EAB briefing that touches Intel — capital spending, plants, M&A, earnings and policy exposure. 28 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 26 of 28
- Subject of the briefing
- 8
- Named as exposed
- 20
- Desks
- Semiconductors (27), Analysis (1)
Intel joins Applied Materials in $5 billion chip R&D hubMembers
The partnership connects Oregon labs to Silicon Valley cleanrooms as foundry rivals TSMC and Samsung Electronics share toolmaker…
Elon Musk rejects TSMC Terafab deal, backing Intel 14A nodeMembers
Tesla and SpaceX will build and run the $16.8 billion Texas AI chip site directly, while Intel continues technical work on its…
TSMC raises foundry prices for fabless clients by up to 10% in 2027
Mature process nodes face 3% to 10% increases in January while chip designers prepare price hikes of up to double digits to…
AMD and Intel lift chip prices 10% on higher TSMC wafer fees
The planned markups across client processors and accelerators pass through foundry price hikes of up to 10% as advanced packaging…
TSMC Dismisses Terafab Rumors as Texas Factory Talks Surface
While TSMC dismissed market talk of joining Elon Musk's 1-terawatt AI compute initiative, Intel remains the sole confirmed…
China Substrate Makers Speed Glass Core Lines for AI Chips
BOE and domestic suppliers deployed automated through-glass via tools to challenge Korean rivals for next-generation…
TSMC begins 1.4nm pilot wafer runs ahead of 2028 volume rampMembers
The foundry accelerated trial activity across Hsinchu and Taichung as it pre-empts rival nodes from Intel and Samsung for…
SK hynix weighs Intel alliance for U.S. memory productionMembers
Preliminary talks explore front-end wafer fabrication at Intel's Ohio site alongside SK hynix's $4 billion Indiana packaging…
TSMC and Samsung set High-NA EUV roadmaps for sub-2nm nodes
The foundries committed to ASML's next-generation lithography tools to bridge patterning limits, facing machine costs near $400…
AMD raises AI accelerator prices 10% on TSMC foundry costs
A planned fourth-quarter price adjustment covers enterprise Instinct accelerators and graphics cards while leaving consumer…
Taiwan clears TSMC fab site for sub-1.4nm chips at Longtan
The National Development Council approved an NT$95.6 billion layout across 104 hectares, granting Taiwan Semiconductor…
TSMC warns AI cannot solve physical barriers for 1.4nm chips
Co-Chief Operating Officer Y.J. Mii warns that automated design tools cannot bypass physical manufacturing limits as the foundry…
SK hynix subsidiary Solidigm weighs NAND fab in New York
The South Korean memory producer said Sept. 18 that no terms are settled, as Washington pressures foreign chipmakers to onshore…
SK hynix denies US memory fab deal with Intel at Ohio site
The South Korean memory maker refuted reports of leasing space at Intel's New Albany facility, while Seoul noted any HBM transfer…
TSMC revenue rises 53% on AI demand to record NT$514 billion
The Taiwanese contract chipmaker reached NT$514.81 billion in August sales as advanced-node orders widened its global foundry…
TSMC Reaffirms 2028 Target for 1.4nm Chips at Taichung Fab
Taiwan's park authority moves Fab 25 completion to April 2027, but the foundry giant leaves its commercial A14 manufacturing…
SK hynix and foundries advance hybrid bonding for AI silicon in 2027
TSMC tasks Asian suppliers with developing five-micrometer microbumps while Samsung and SK hynix prepare direct copper…
TSMC widens High-NA EUV alliance to build 12-inch photomasks by 2031
The foundry expanded supplier partnerships on Sept. 10 to establish larger reticle formats with ASML, targeting a 40% scanner…
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
Japanese photoresist makers validate metal oxide resist lines for High-NA EUV chipmaking
JSR, TOK and Adeka advance inorganic patterning materials as leading foundries test sub-2nm lines on ASML 0.55 NA scanners.
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Montage and Panmnesia validate CXL 3.1 memory silicon with Samsung and SK hynix
East Asian chip designers and memory manufacturers begin sampling PCIe 6.2 controllers and switches to scale AI server memory…
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…