Mobilint tests robot AI chips with Doosan to curb Nvidia costs
South Korea will invest 511.1 billion won through 2030 to deploy domestic neural processing units across collaborative arms,…
Company watch
All companies →Nvidia
Every EAB briefing that touches Nvidia — capital spending, plants, M&A, earnings and policy exposure. 51 briefings.
- First seen
- August 28, 2026
- Latest
- October 12, 2026
- With a linked document
- 50 of 51
- Subject of the briefing
- 8
- Named as exposed
- 45
- Desks
- Semiconductors (36), Robotics (7), Batteries & EV (4), Trade & Policy (3), Analysis (1)
TSMC captures 72.5% foundry share as gap with Samsung widensMembers
Surging demand for artificial intelligence processors and proprietary advanced packaging leaves contract rivals trailing across…
TSMC begins 1.4nm pilot wafer runs ahead of 2028 volume rampMembers
The foundry accelerated trial activity across Hsinchu and Taichung as it pre-empts rival nodes from Intel and Samsung for…
Korean power gear makers book grid orders on US fab growth
Surging battery storage deployments and grid bottlenecks across North America lift combined order backlogs at South Korea's three…
Nvidia locks up 37% of global HBM supply for AI accelerators
Surging procurement commitments reach $279 billion as the chip designer and cloud rivals absorb 85% of advanced DRAM lines,…
Taiwan breaks ground on TSMC packaging base to relieve CoWoS limits
The 88.7-hectare Baipu park will host tool-validation labs and supplier lines to ease advanced chip packaging constraints for AI…
SK hynix taps HanmiGlobal for $4B Indiana HBM packaging fab
The project management contract solidifies construction of America's first advanced AI memory facility in West Lafayette ahead of…
LG Energy Solution wins NVIDIA DSX Ready status for AI power backup
The South Korean battery maker joins Tesla and Hitachi Energy in the chip designer's validated equipment list, offering…
TSMC warns AI cannot solve physical barriers for 1.4nm chips
Co-Chief Operating Officer Y.J. Mii warns that automated design tools cannot bypass physical manufacturing limits as the foundry…
Samsung Electronics opens HBM4 base die supply to rival TSMC for AI
The South Korean memory maker will offer customers external wafer fabrication alongside its internal 4nm lines as it prepares…
SK hynix taps TSMC for 3D DRAM logic, diverging from Samsung in 2026
The memory maker is outsourcing peripheral circuit fabrication to Taiwanese foundries, challenging Samsung Electronics' vertical…
FANUC debuts Physical AI robotics for flexible factory lines
The Japanese automation giant demonstrated autonomous mobile cobots and generative vision models in Chicago to eliminate rigid…
TSMC revenue rises 53% on AI demand to record NT$514 billion
The Taiwanese contract chipmaker reached NT$514.81 billion in August sales as advanced-node orders widened its global foundry…
DeepSeek cuts AI memory use 75%, rattling global chipmakers
The Chinese startup compressed key-value cache memory in its DeepSeek-V4.1-Flash model, erasing up to 3.5% of market value at…
OpenAI denies Samsung foundry deal for custom AI processors
A clarification follows Seoul executive remarks on joint chip work, keeping TSMC as primary fabricator while preserving Samsung…
TSMC Reaffirms 2028 Target for 1.4nm Chips at Taichung Fab
Taiwan's park authority moves Fab 25 completion to April 2027, but the foundry giant leaves its commercial A14 manufacturing…
Doosan Robotics targets 2028 humanoid trials on factory lines
The South Korean cobot builder aims to deploy worker-mimicking humanoid prototypes in 2028, combining proprietary torque sensors…
FANUC America links factory robots to Palladyne AI platform
The partnership integrates the Palladyne IQ platform into industrial manipulators to give production lines closed-loop autonomy…
Li Auto adopts in-house batteries across all models to cut costs
The Chinese electric vehicle maker will phase out CATL cells on its flagship Mega and upcoming i9 after vehicle margins fell to…
Samsung deploys TSMC-tested photonics probers for CPO push
The South Korean chipmaker deployed FormFactor and MPI probe stations to inspect optical wafers internally, aligning with TSMC…
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
Xi Jinping plans business delegation for Donald Trump summit
Beijing aims to ease trade friction and protect cross-border commerce as U.S.
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…