TSMC widens CoWoS supply chain with $2 billion US interposer deal
A five-year agreement with GlobalFoundries establishes the first US manufacturing source for AI silicon interposers, challenging…
Company watch
All companies →Advanced Micro Devices
Every EAB briefing that touches Advanced Micro Devices — capital spending, plants, M&A, earnings and policy exposure. 9 briefings.
- First seen
- August 28, 2026
- Latest
- October 12, 2026
- With a linked document
- 8 of 9
- Subject of the briefing
- 4
- Named as exposed
- 5
- Desks
- Semiconductors (9)
TSMC weighs Texas foundry campus to expand US chip capacity
Deliberations over an additional manufacturing site follow $265 billion committed to Arizona, as North American customers…
AMD and Intel lift chip prices 10% on higher TSMC wafer fees
The planned markups across client processors and accelerators pass through foundry price hikes of up to 10% as advanced packaging…
Synopsys certifies TSMC A14 EDA flows and tapes out 64G UCIe
The milestone expands 2-nanometer IP libraries for HBM4 memory and CoWoS packaging, locking fabless chipmakers into angstrom-era…
Taiwan breaks ground on TSMC packaging base to relieve CoWoS limits
The 88.7-hectare Baipu park will host tool-validation labs and supplier lines to ease advanced chip packaging constraints for AI…
AMD raises AI accelerator prices 10% on TSMC foundry costs
A planned fourth-quarter price adjustment covers enterprise Instinct accelerators and graphics cards while leaving consumer…
AMD Reaffirms TSMC Alliance While Evaluating Rival Foundries
The chip designer projected an AI market of up to $3 trillion by 2030, keeping its wafer volume anchored at TSMC while conducting…
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…