Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
Company watch
All companies →Intel
Every EAB briefing that touches Intel — capital spending, plants, M&A, earnings and policy exposure. 28 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 26 of 28
- Subject of the briefing
- 8
- Named as exposed
- 20
- Desks
- Semiconductors (27), Analysis (1)
Japan Expands CMP Slurry Lines for Backside Power
Japanese suppliers of chemical mechanical planarization consumables are accelerating capital spending across domestic…
South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…