SK hynix weighs Intel alliance for U.S. memory production
Preliminary talks explore front-end wafer fabrication at Intel's Ohio site alongside SK hynix's $4 billion Indiana packaging facility, though no binding agreements exist.
JHBy Ji-woo Han, Korea bureau chief··Updated September 22, 2026·3 min read
ShareLinkedInXWhatsAppEmailA technician in cleanroom attire monitors automated machinery processing semiconductor components inside a chip fabrication facility. (AI-generated image)
SK hynix weighed options on Sept. 21 to manufacture memory chips with Intel in the United States, evaluating shared fab capacity to hedge against U.S. tariff risks.
The South Korean chipmaker committed $4 billion to an advanced packaging site in Indiana last month. That facility represents SK hynix's first manufacturing base on American soil, but it excludes front-end wafer fabrication.
The documents behind this briefing are linked above. East Asia Brief produces its English text with AI assistance under human editorial review, and does not translate or republish other outlets' articles. See our methodology and AI policy. Spotted an error? Tell us.
Korea bureau chief — Ji-woo Han leads Korea coverage, working from exchange disclosures, ministry notices and company IR material. She writes most often on memory and advanced packaging.
