AMD and Intel lift chip prices 10% on higher TSMC wafer fees
The planned markups across client processors and accelerators pass through foundry price hikes of up to 10% as advanced packaging…
Company watch
All companies →Samsung Electronics
Every EAB briefing that touches Samsung Electronics — capital spending, plants, M&A, earnings and policy exposure. 105 briefings.
- First seen
- August 28, 2026
- Latest
- October 13, 2026
- With a linked document
- 98 of 105
- Subject of the briefing
- 54
- Named as exposed
- 52
- Desks
- Semiconductors (82), Robotics (12), Analysis (7), Energy & Minerals (2), Trade & Policy (1), Batteries & EV (1)
Samsung starts Exynos 2700 production, lifting run size 10%
The 2nm processor targets Galaxy S27 handsets in Korea and Europe, trimming reliance on Qualcomm as Samsung Foundry works to…
TSMC Dismisses Terafab Rumors as Texas Factory Talks Surface
While TSMC dismissed market talk of joining Elon Musk's 1-terawatt AI compute initiative, Intel remains the sole confirmed…
Micron Cuts DRAM Lead of SK hynix to One Point on HBM Demand
The US chipmaker reached 24% of global DRAM revenue in the second quarter as SK hynix fell to 25%, testing Korean memory pricing…
JSR opens South Korea EUV photoresist plant for 2nm chips
The 75 billion won facility in Ochang establishes local finishing lines for metal oxide resist, positioning the Japanese supplier…
Rainbow Robotics taps E Tech Group to expand US cobot fleet
The agreement appoints the Rockwell Automation Platinum partner to handle deployment and warranty service across North American…
Samsung says HBM will take 30% of DRAM wafer capacity by 2027
The shift crowds out standard DDR5 output across shared lines, while research firm TrendForce projects average selling prices for…
SFA and Rainbow Robotics form pact on autonomous fab systems
The non-binding agreement combines factory logistics software with precision robotic arms to pursue fully unmanned semiconductor…
SK hynix Evaluates Solidigm US IPO Amid Governance Scrutiny
Reports of a potential $150 billion U.S. listing for the enterprise SSD subsidiary highlight booming AI storage demand while…
SK hynix resumes DRAM packaging outsourcing to vendor Winpac
The memory maker is allocating DDR4 and DDR5 flip-chip assembly to the domestic OSAT provider, shifting legacy backend operations…
Chip fab expansion drives cleanroom SCARA robot demand globally
Global industrial robotics revenue will reach $88.66 billion by 2030 as electronics makers and semiconductor fabs deploy…
Korea unfreezes Honam grid to add 2.6 GW of solar capacity
The policy ends a two-year connection freeze across 164 substations on Oct.
OCI anchors Jeonbuk chip materials hub with acid expansion
The chemical maker will lift Gunsan phosphoric acid capacity to 30,000 tons as South Korea commits 45 billion won to anchor an…
SK hynix validates HBM5 with TSMC on next-generation CoWoS
The South Korean chipmaker secured TSMC's partner award after completing thermal and electrical trials on eighth-generation…
TSMC plans to lift wafer foundry prices by 3% to 6% from 2027
Leading-edge 2-nanometer and 3-nanometer lines face the steepest increases as AI chip demand fills foundry capacity through 2030…
Synopsys certifies TSMC A14 EDA flows and tapes out 64G UCIe
The milestone expands 2-nanometer IP libraries for HBM4 memory and CoWoS packaging, locking fabless chipmakers into angstrom-era…
TSMC raises 2nm wafer target to 120,000 units as orders surge
The foundry lifted internal production goals by pulling forward capacity additions after Apple, Nvidia and three other anchor…
TSMC captures 72.5% foundry share as gap with Samsung widensMembers
Surging demand for artificial intelligence processors and proprietary advanced packaging leaves contract rivals trailing across…
Qualcomm keeps TSMC for 2nm processors, shutting out Samsung Foundry
The mobile chipmaker affirmed its exclusive production tie to TSMC despite wafer costs topping $30,000, leaving Samsung with…
White House keeps chip export controls after Xi-Trump summit
Bilateral summit readouts carve out $30 billion in consumer goods for tariff relief, but U.S.
Nvidia locks up 37% of global HBM supply for AI accelerators
Surging procurement commitments reach $279 billion as the chip designer and cloud rivals absorb 85% of advanced DRAM lines,…
KKR deploys record $3 billion into South Korea AI hardware
The private equity firm is targeting data center platforms, enterprise services and clean generation capacity tied to advanced…
TSMC and Samsung set High-NA EUV roadmaps for sub-2nm nodes
The foundries committed to ASML's next-generation lithography tools to bridge patterning limits, facing machine costs near $400…
CXMT starts 5th-gen DRAM output, bypassing US tool controls
The Chinese chipmaker deployed deep ultraviolet quadruple patterning to reach an 11.95-nanometer half-pitch and began volume runs…