Samsung deploys TSMC-tested photonics probers for CPO push
The South Korean chipmaker deployed FormFactor and MPI probe stations to inspect optical wafers internally, aligning with TSMC…
Company watch
All companies →Samsung Electronics
Every EAB briefing that touches Samsung Electronics — capital spending, plants, M&A, earnings and policy exposure. 105 briefings.
- First seen
- August 28, 2026
- Latest
- October 13, 2026
- With a linked document
- 98 of 105
- Subject of the briefing
- 54
- Named as exposed
- 52
- Desks
- Semiconductors (82), Robotics (12), Analysis (7), Energy & Minerals (2), Trade & Policy (1), Batteries & EV (1)
TSMC sees 3nm revenue overtake 5nm node on surge in AI accelerators
Surging orders for Nvidia and Apple processors will push third-quarter 3nm output value above $12.7 billion, reinforcing the…
Samsung denies Chinese tool testing as US tightens fab controls
South Korean memory makers face annual US export reviews for their Chinese fabs as Washington curbs equipment servicing and…
EcoPro targets humanoid robot batteries for 2027 production
The South Korean cathode producer plans to supply high-nickel and solid-state materials to robotics makers before expanding…
Samsung narrows SK hynix HBM lead as HBM4 shipments expand
Counterpoint Research data shows Samsung captured 33% of second-quarter HBM revenue, halving the lead of SK hynix as chipmakers…
Air Products commits record capital to South Korea chip fabs
The industrial gas supplier filed plans with Seoul on Sept. 4 to build dedicated Pyeongtaek facilities for Samsung Electronics,…
SK hynix starts $4 billion packaging plant in Indiana to feed US AI
The Purdue Research Park campus will open cleanrooms in October 2028 before starting mass production of next-generation…
US chip suppliers commit $2 billion to South Korea semiconductor supply chain
Air Products, Axcelis, Corning and Pacifico Energy signed direct investment filings in Washington to expand fab tooling,…
TSMC Urges HBM Makers to Adopt X-Ray Friendly Chip Design for Advanced Packaging
Zhihua Zou told a Taipei forum that buried defects in multi-layer stacks require memory redesigns to prevent radiation damage…
Korea presses US for equal chip tariff terms as Lutnick warns of import levies
Trade Minister Kim Jung-kwan said Seoul is negotiating to ensure domestic chipmakers face terms no worse than competitors under…
KEPCO seeks $18 billion advance power bill payment from Samsung and SK hynix
The state utility wants five years of electricity fees paid upfront to fund transmission lines for the Yongin semiconductor…
CXMT starts pilot HBM3E production as China accelerates AI chip self-reliance
Chinese memory maker CXMT is testing fifth-generation high-bandwidth memory with domestic chip designers following United States…
Bigwave Robotics partners with automation suppliers to scale US physical AI
South Korean robotics platform integrator forms commercial alliances with FANUC, Rockwell Automation and Rainbow Robotics to…
LG taps Samsung Foundry for appliance AI chips under Korean state project
The 31 billion won development consortium marks a rare shift by LG away from TSMC as Seoul backs domestic edge processor supply…
Korean tool makers advance high-k ALD platforms for sub-10nm 3D DRAM fabs
State-backed R&D programs and fab equipment vendors target ultra-thin capacitor films with dielectric constants above 100 for…
Japanese photoresist makers validate metal oxide resist lines for High-NA EUV chipmaking
JSR, TOK and Adeka advance inorganic patterning materials as leading foundries test sub-2nm lines on ASML 0.55 NA scanners.
Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Magnetic levitation wafer transfer robots advance into South Korean semiconductor cleanrooms
Chipmakers deploy contactless vacuum handling systems to eliminate particle defects in sub-two-nanometer fabrication as domestic…
Montage and Panmnesia validate CXL 3.1 memory silicon with Samsung and SK hynix
East Asian chip designers and memory manufacturers begin sampling PCIe 6.2 controllers and switches to scale AI server memory…
EUV Materials Suppliers in Korea and Japan Advance High-Power CNT Pellicle Mass Testing
FST, Mitsui Chemicals, and LINTEC expand dedicated manufacturing capacity as advanced semiconductor fabs qualify carbon nanotube…
Foundries Standardize 300mm Silicon Photonics PDKs for AI Optical Interconnects
Commercial co-packaged optics platforms from TSMC, Samsung, and Tower target interconnect bottlenecks and thermal limits across…
Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
Japan Expands CMP Slurry Lines for Backside Power
Japanese suppliers of chemical mechanical planarization consumables are accelerating capital spending across domestic…
High-purity hydrogen peroxide supply chains face regional bottlenecks across East Asian fabs [90 characters]
Semiconductor wafer manufacturers in South Korea, Taiwan, and Japan rely on localized ultra-pure chemical purification networks…