Murata completes Vietnam inductor plant for power components
The 3-billion-yen facility in Dong Nai expands passive component manufacturing outside China as electric vehicles and server…
Company watch
All companies →Samsung Electro-Mechanics
Every EAB briefing that touches Samsung Electro-Mechanics — capital spending, plants, M&A, earnings and policy exposure. 6 briefings.
- First seen
- August 28, 2026
- Latest
- October 11, 2026
- With a linked document
- 5 of 6
- Subject of the briefing
- 3
- Named as exposed
- 3
- Desks
- Semiconductors (6)
Hanmi Semiconductor wins $18 million tool deal from Samsung
The 24.48 billion won order for substrate saw and inspection equipment marks the supplier's first major contract with a Samsung…
China Substrate Makers Speed Glass Core Lines for AI Chips
BOE and domestic suppliers deployed automated through-glass via tools to challenge Korean rivals for next-generation…
South Korean toolmakers advance glass substrate TGV laser drillers to volume lines
Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…
Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…