Doosan commits $397 million to China advanced chip packaging materials
The Changshu project represents 57% of Doosan's electronic materials budget as global advanced packaging spending reaches $28 billion this year.
Doosan committed 550 billion won ($397 million) on Nov. 6 to expand high-end packaging materials in China, reinforcing a multibillion-dollar capital spending drive across East Asia to ease artificial intelligence chip shortages.
The Changshu project accounts for 57% of Doosan's 970 billion won ($700 million) electronic materials program, the company said. Global capital expenditure on advanced semiconductor packaging will reach $28 billion this year, exceeding traditional packaging spending for the first time.
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