Samsung opens Yokohama chip packaging lab to rival TSMC lead
The $280 million research site secures Japanese state subsidies to integrate domestic materials suppliers into Samsung's backend…
Company watch
All companies →Ibiden
Every EAB briefing that touches Ibiden — capital spending, plants, M&A, earnings and policy exposure. 3 briefings.
- First seen
- August 28, 2026
- Latest
- September 8, 2026
- With a linked document
- 2 of 3
- Subject of the briefing
- 1
- Named as exposed
- 2
- Desks
- Semiconductors (3)
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…
Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand
Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from…