South Korean toolmakers advance glass substrate TGV laser drillers to volume lines
Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.
Company watch
All companies →LG Innotek
Every EAB briefing that touches LG Innotek — capital spending, plants, M&A, earnings and policy exposure. 2 briefings.
- First seen
- August 28, 2026
- Latest
- August 30, 2026
- With a linked document
- 2 of 2
- Subject of the briefing
- 1
- Named as exposed
- 1
- Desks
- Semiconductors (2)
South Korean substrate makers develop embedded silicon bridges for AI chips
LG Innotek and Samsung Electro-Mechanics advance bridge-embedded FC-BGA substrates to lower 2.5D packaging costs for AI…