Silicon interposer scaling drives foundry and OSAT shifts in 3.5D chiplets
Hybrid bonding and ultra-thin interposers reshape advanced packaging supply chains as fabless AI accelerator designers navigate…
Company watch
All companies →JCET Group
Every EAB briefing that touches JCET Group — capital spending, plants, M&A, earnings and policy exposure. 4 briefings.
- First seen
- August 28, 2026
- Latest
- August 30, 2026
- With a linked document
- 2 of 4
- Subject of the briefing
- 3
- Named as exposed
- 1
- Desks
- Semiconductors (4)
China RISC-V Chipmakers Tap Domestic 14nm Nodes for Industrial AI
Chinese fabless designers are taping out custom RISC-V edge accelerators on SMIC 14nm lines to bypass advanced packaging…
China DRAM Makers Advance Proprietary Vertical Stacking to Counter HBM Export Curbs
Domestic memory fabricators and packaging houses deploy customized TSV tools and hybrid bonding to build localized high-bandwidth…
JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.