Broadcom adds packaging past TSMC as custom AI chips surge
With TSMC supplying 95% of front-end wafers while Nvidia secures CoWoS capacity, Broadcom is preparing packaging options with Samsung and Intel.
MOBy Mina Okoro, Supply chain editor··Updated November 5, 2026·3 min read
ShareLinkedInXWhatsAppEmailA robotic arm handles a semiconductor processor during packaging assembly inside a cleanroom manufacturing facility. (AI-generated image)
Broadcom and Taiwan Semiconductor Manufacturing Co. navigated mounting bottlenecks across artificial intelligence processor packaging on Nov. 5, 2026, as cloud hyperscalers expanded custom silicon orders to curb merchant graphics chip expenses.
The custom silicon push centers on application-specific integrated circuits (ASICs) — tailor-made processors designed for dedicated neural network workloads — which require specialized multi-die packaging to link compute logic with memory.
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Supply chain editor — Mina Okoro builds the impact maps that connect East Asian developments to buyers in North America and Europe, and edits the Asia Compare desk.
