Rapidus holds 2nm chip timeline as 17 partners join network
The Japanese venture keeps its 2027 mass-production goal while enlisting Cadence and Synopsys to lower design barriers against…
Company watch
All companies →Dai Nippon Printing
Every EAB briefing that touches Dai Nippon Printing — capital spending, plants, M&A, earnings and policy exposure. 5 briefings.
- First seen
- August 28, 2026
- Latest
- October 9, 2026
- With a linked document
- 4 of 5
- Subject of the briefing
- 1
- Named as exposed
- 4
- Desks
- Semiconductors (5)
Rapidus forms 17-firm design alliance to back 2nm chip ramp
The Japanese foundry partnered with Synopsys, Cadence and domestic design houses to build an IP library and reduce client…
Nexchip injects $128M into Anhui Jingmei to secure photomask supplyMembers
The transaction transfers tooling subsidiary Hefei Jingwei to Anhui Jingmei as part of a 2.2 billion yuan expansion, lifting the…
Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips
HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography…
Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target
Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with…