Samsung opens Yokohama chip packaging lab to rival TSMC lead
The $280 million research site secures Japanese state subsidies to integrate domestic materials suppliers into Samsung's backend…
Company watch
All companies →Resonac
Every EAB briefing that touches Resonac — capital spending, plants, M&A, earnings and policy exposure. 2 briefings.
- First seen
- August 28, 2026
- Latest
- September 8, 2026
- With a linked document
- 2 of 2
- Subject of the briefing
- 1
- Named as exposed
- 1
- Desks
- Semiconductors (2)
Japanese epoxy mold makers reformulate resins to tame warpage in 16-high memory
Chemical suppliers modify spherical silica filler morphology and polymer matrices to counter extreme thermomechanical stress…