TSMC widens CoWoS supply chain with $2 billion US interposer deal
A five-year agreement with GlobalFoundries establishes the first US manufacturing source for AI silicon interposers, challenging…
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All companies →Disco
Every EAB briefing that touches Disco — capital spending, plants, M&A, earnings and policy exposure. 3 briefings.
- First seen
- September 8, 2026
- Latest
- October 12, 2026
- With a linked document
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- Semiconductors (3)
Hanmi Semiconductor wins $18 million tool deal from Samsung
The 24.48 billion won order for substrate saw and inspection equipment marks the supplier's first major contract with a Samsung…
Samsung opens Yokohama chip packaging lab to rival TSMC lead
The $280 million research site secures Japanese state subsidies to integrate domestic materials suppliers into Samsung's backend…