TOPPAN and Broadcom open Singapore plant for AI substrates
The 95,000-square-meter facility in Jurong marks TOPPAN’s first overseas FC-BGA base and Broadcom’s push to secure critical…
Company watch
All companies →NXP Semiconductors
Every EAB briefing that touches NXP Semiconductors — capital spending, plants, M&A, earnings and policy exposure. 4 briefings.
- First seen
- August 28, 2026
- Latest
- September 29, 2026
- With a linked document
- 3 of 4
- Subject of the briefing
- 2
- Named as exposed
- 2
- Desks
- Semiconductors (3), Trade & Policy (1)
Vanguard and NXP open Singapore fab, weigh second chip plant
The $6.7 billion joint facility begins risk production at 40nm to 130nm nodes, offering Western automotive and AI hardware…
Korea FTC Targets NXP and Analog Devices Over Chip Distribution Pricing Controls
Antitrust examiners initiate formal proceedings over Ship and Debit margin caps and client allocation in non-memory component…
JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.