East Asia materials makers accelerate diamond heat spreaders for 1000W AI chips
Advanced packaging suppliers across South Korea, Japan, and China target metal-diamond substrates and engineered TIMs to clear…
Company watch
All companies →Resonac Holdings
Every EAB briefing that touches Resonac Holdings — capital spending, plants, M&A, earnings and policy exposure. 5 briefings.
- First seen
- August 28, 2026
- Latest
- August 30, 2026
- With a linked document
- 2 of 5
- Subject of the briefing
- 5
- Desks
- Analysis (2), Semiconductors (2), Trade & Policy (1)
Japan Expands CMP Slurry Lines for Backside Power
Japanese suppliers of chemical mechanical planarization consumables are accelerating capital spending across domestic…
Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target
Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with…
East Asia accelerates 8-inch silicon carbide capacity race as power chip makers scale output
Fabricators across Japan, China, and South Korea add 200mm SiC substrate and epi lines to lower automotive inverter costs.
Japan tenders economic security subsidies for synthetic graphite anode substitutes
METI opens dedicated funding rounds for silicon-dominant and hard-carbon anode projects to insulate domestic battery lines from…