Korea Foundries Shift 200mm Lines to Auto PMICs as EV Architectures Advance
DB HiTek and SK keyfoundry reallocate mature 200mm wafer capacity toward high-voltage automotive power management ICs to counter…
Company watch
All companies →DB Hitek
Every EAB briefing that touches DB Hitek — capital spending, plants, M&A, earnings and policy exposure. 3 briefings.
- First seen
- August 28, 2026
- Latest
- August 28, 2026
- With a linked document
- 1 of 3
- Subject of the briefing
- 2
- Named as exposed
- 1
- Desks
- Semiconductors (2), Analysis (1)
East Asia accelerates 8-inch silicon carbide capacity race as power chip makers scale output
Fabricators across Japan, China, and South Korea add 200mm SiC substrate and epi lines to lower automotive inverter costs.
Samsung Foundry converts mature planar lines to automotive power chips
The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…