Sumitomo Bakelite expands Asian chip molding compound lines
New production lines in Suzhou and Singapore will double mold underfill capacity and triple granular compound output to supply…
Company watch
All companies →Kyocera
Every EAB briefing that touches Kyocera — capital spending, plants, M&A, earnings and policy exposure. 3 briefings.
- First seen
- September 1, 2026
- Latest
- October 11, 2026
- With a linked document
- 3 of 3
- Subject of the briefing
- 2
- Named as exposed
- 1
- Desks
- Semiconductors (2), Robotics (1)
METI Pools Factory Machine Data to Train Physical AI Models
Tokyo coordinates with DMG Mori and Komatsu to assign unified IDs across 1,600 tools, targeting 100 terabytes of shop data to…
Kyocera opens 68 billion yen Nagasaki plant for AI chip packaging
The Japanese components maker completed construction of its Isahaya site on Sept.