East Asian SiC wafer makers shift to laser slicing to cut 8-inch ingot processing lossMembers
Slicing and polishing yield disparities across Japan, China and South Korea redefine 200-millimeter silicon carbide substrate…
Company watch
All companies →SK Siltron
Every EAB briefing that touches SK Siltron — capital spending, plants, M&A, earnings and policy exposure. 3 briefings.
- First seen
- August 28, 2026
- Latest
- August 30, 2026
- With a linked document
- 1 of 3
- Subject of the briefing
- 2
- Named as exposed
- 1
- Desks
- Analysis (2), Semiconductors (1)
East Asia accelerates 8-inch silicon carbide capacity race as power chip makers scale output
Fabricators across Japan, China, and South Korea add 200mm SiC substrate and epi lines to lower automotive inverter costs.
China expands 300mm silicon wafer capacity to cut reliance on Japanese suppliers
Domestic wafer manufacturers scale 12-inch polished and epitaxial shipments to supply local foundries, displacing imported…