South Korea funds advanced chip packaging and backside power pilot lines
The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer…
Ji-woo Han leads Korea coverage, working from exchange disclosures, ministry notices and company IR material. She writes most often on memory and advanced packaging.
2 briefings
Samsung Foundry converts mature planar lines to automotive power chips
The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab…