JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand
China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant.
Wei Zhang covers Chinese fabs, domestic equipment substitution and the packaging capacity being built to work around import restrictions.
4 briefings
China expands 300mm silicon wafer capacity to cut reliance on Japanese suppliers
Domestic wafer manufacturers scale 12-inch polished and epitaxial shipments to supply local foundries, displacing imported…
China DRAM Makers Advance Proprietary Vertical Stacking to Counter HBM Export Curbs
Domestic memory fabricators and packaging houses deploy customized TSV tools and hybrid bonding to build localized high-bandwidth…
Naura and SMEE Accelerate Domestic Tool Shipments to Chinese Fabs
Chinese chipmakers expand procurement of domestic etching and lithography tools as foundries push to insulate production lines…