Towa plans Kyoto plant to onshore chip packaging equipment
The 5 billion yen facility in Ujitawara will produce resin compression molding systems for artificial intelligence chips starting…
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All companies →Towa Corporation
Every EAB briefing that touches Towa Corporation — capital spending, plants, M&A, earnings and policy exposure. 1 briefing.
- First seen
- October 7, 2026
- Latest
- October 7, 2026
- With a linked document
- 1 of 1
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- 1
- Desks
- Semiconductors (1)