# South Korean toolmakers advance glass substrate TGV laser drillers to volume lines *Philoptics, EO Technics and LG Electronics deploy laser drilling tools as packaging makers validate glass cores for AI chiplets.* **Published:** August 30, 2026 **By:** Ji-woo Han **Section:** Semiconductors & AI Hardware — South Korea **Format:** Why It Matters **Confidence:** medium **Source:** https://eastasiabrief.com/semiconductors/south-korean-toolmakers-advance-glass-substrate-tgv-laser-drillers-127 **Publisher:** East Asia Brief (https://eastasiabrief.com/) --- ## What to know - Philoptics shipped its first commercial laser equipment for through-glass via drilling to advanced semiconductor packaging lines on March 28, 2024, initiating yield verification for next-generation glass core substrates. - The company deepened deliveries under a supply agreement signed on Sept. - Glass core substrates replace traditional organic cores made of bismaleimide triazine resin and ajinomoto build-up film. ![A cleanroom technician monitors automated laser equipment processing a glass substrate inside a facility. (AI-generated image)](https://eastasiabrief.com/media/2026-08-30-c7c94bf7b91c.webp) *A cleanroom technician monitors automated laser equipment processing a glass substrate inside a facility. (AI-generated image)* Philoptics shipped its first commercial laser equipment for through-glass via drilling to advanced semiconductor packaging lines on March 28, 2024, initiating yield verification for next-generation glass core substrates. The company deepened deliveries under a supply agreement signed on Sept. 11, 2024 with a tier-one global glass materials maker. The tool installations marked the first deployment of domestic laser hole-drilling systems to commercial glass substrate lines. Glass core substrates replace traditional organic cores made of bismaleimide triazine resin and ajinomoto build-up film. The material offers superior flatness, rigidity and thermal resistance required to host large multi-chiplet artificial intelligence processors. Conventional organic substrates warp under the thermal stress of high-density computing packages. Glass matches the thermal expansion coefficient of silicon dies, allowing engineers to route finer circuit lines across larger panel dimensions. Drilling through-glass via (TGV) channels represents the primary manufacturing bottleneck for glass core adoption. Toolmakers must form millions of microscopic holes across thin panels without generating micro-cracks or edge chipping that fracture the brittle material. Laser-assisted processing alters the localized microstructure of the glass core using ultra-short pulse bursts. A subsequent chemical wet-etching bath removes the modified areas to create uniform vertical vias for copper metallization. Philoptics began developing specialized laser systems for glass substrate packaging in 2019. The company outlined in its annual business report filed on March 17, 2025 that it supplies mass-production laser TGV systems and direct-imaging lithography exposure units. South Korea's Ministry of Trade, Industry and Energy selected Philoptics on Oct. 29, 2025 as a top national enterprise for materials, parts and equipment. The designation provided state research backing to refine fine-pitch TGV hole formation alongside domestic robotics and optical inspection partners. Chief Executive Han Ki-soo told shareholders at the company's annual meeting on March 25, 2026 that Philoptics plans to raise semiconductor equipment to 70% of total revenue. Most glass-handling systems operate in customer qualification phases ahead of expanded line conversions. EO Technics expanded testing of its proprietary ultraviolet laser drillers with international semiconductor manufacturers. The company verified diode-pumped solid-state laser tools designed to drill micro-vias without applying mechanical contact stress to fragile glass panels. The equipment maker conducted customer pilot runs through mid-2025 to evaluate via shape consistency, taper control and processing speed. The non-contact laser mechanism aims to reduce substrate breakage rates during the high-speed hole formation phase. LG Electronics Production Engineering Research Institute disclosed on July 13, 2026 that it developed the AVEX-P500 laser drilling system for semiconductor glass substrates. The internal equipment division demonstrated prototype panels containing 5.45 million micro-holes on a single glass core. The AVEX-P500 platform demonstrated a 1:10 aspect ratio on 0.5-millimeter glass samples and verified defect-detection algorithms that inspect modified hole patterns prior to chemical etching. LG Innotek is evaluating the system for its planned substrate packaging lines. Substrate manufacturers are expanding pilot facilities across North America and East Asia. SKC subsidiary Absolics completed construction of its glass substrate manufacturing plant in Covington, Georgia, to produce commercial glass interposers for high-performance computing customers. Samsung Electro-Mechanics established an operational glass substrate pilot line at its Sejong manufacturing facility in South Korea. The component maker installed prototype laser and wet-etching tools to build test vehicles for server-class processors. Glass manufacturers including Schott and Corning are supplying specialized ultra-thin glass sheets engineered to withstand repetitive thermal cycles. Toolmakers must maintain precise beam positioning across substrate panel formats measuring 510 by 515 millimeters and 600 by 600 millimeters. Forming high-density vertical interconnects requires via diameters below 10 micrometers with minimal pitch spacing. Deviations in hole taper or surface roughness weaken copper plating adhesion and induce electrical signal leakage between vertical channels. Toolmakers are focusing engineering resources on defect-detection metrology to capture micro-fissures before chemical immersion. Early inspection reduces wafer-level waste and prevents catastrophic substrate shattering during subsequent thermal annealing steps. Packaging fabricators continue parallel evaluations of direct laser ablation and laser-induced deep etching methods. Laser-induced deep etching remains the dominant approach for high-volume lines because chemical baths can etch millions of laser-modified holes simultaneously. Equipment suppliers are aligning tool delivery schedules with substrate maker qualification timelines. Commercial volume production of glass-core packaging substrates remains scheduled across the semiconductor sector between late 2026 and 2027. ## Impact map | Event | Korea | China | Japan | Global impact | | --- | --- | --- | --- | --- | | TGV tool deployment | laser toolmakers commercialize lines | packaging vendors test glass samples | glass material suppliers scale output | AI chiplet substrate bottlenecks ease | ## In this story - **Companies:** Philoptics, EO Technics, LG Electronics - **Tickers:** 161580.KQ, 039030.KQ, 066570.KS - **Exposed:** LG Innotek, Samsung Electro-Mechanics, Absolics - **Policy:** Subsidies, Economic Security - **Impact:** Supply Chain, Capex, Order Book ## Primary sources 1. ddaily.co.kr 2. thinkpool.com 3. philoptics.com 4. hankyung.com 5. dreago.kr --- Cite as: East Asia Brief, "South Korean toolmakers advance glass substrate TGV laser drillers to volume lines," August 30, 2026. https://eastasiabrief.com/semiconductors/south-korean-toolmakers-advance-glass-substrate-tgv-laser-drillers-127