# East Asia Brief — Semiconductors & AI Hardware

Memory, foundry, equipment and materials across Korea, China and Japan — and the export rules that bound them.

- [South Korea funds advanced chip packaging and backside power pilot lines](https://eastasiabrief.com/semiconductors/south-korea-funds-advanced-chip-packaging-backside-power-pilot-66) — The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer architectures for domestic… *(August 28, 2026; Semiconductors · Korea · Samsung Electronics, SK hynix, Hanmi Semiconductor, Hana Micron, Nepes)*
- [JCET expands automotive radar SiP packaging lines to capture ADAS sensor demand](https://eastasiabrief.com/semiconductors/jcet-expands-automotive-radar-sip-packaging-lines-capture-adas-58) — China's largest OSAT is ramping high-density system-in-package capacity for 77 GHz millimeter-wave modules at its Jiangyin plant. *(August 28, 2026; Semiconductors · China · JCET Group)*
- [Samsung Foundry converts mature planar lines to automotive power chips](https://eastasiabrief.com/semiconductors/samsung-foundry-converts-mature-planar-lines-automotive-power-chips-53) — The Korean chipmaker is reallocating 200mm and trailing 300mm fab lines toward BCD and microcontroller processes to defend fab utilization. *(August 28, 2026; Semiconductors · Korea · Samsung Electronics)*
- [China expands 300mm silicon wafer capacity to cut reliance on Japanese suppliers](https://eastasiabrief.com/semiconductors/china-expands-300mm-silicon-wafer-capacity-cut-reliance-japanese-45) — Domestic wafer manufacturers scale 12-inch polished and epitaxial shipments to supply local foundries, displacing imported substrates from Tokyo. *(August 28, 2026; Semiconductors · China · National Silicon Industry Group, Semiconductor Manufacturing International Corporation, Hua Hong Semiconductor, Shin-Etsu Chemical, SUMCO)*
- [Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand](https://eastasiabrief.com/semiconductors/ibiden-shinko-ramp-high-layer-fc-bga-lines-ai-43) — Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from global AI accelerator designers. *(August 28, 2026; Semiconductors · Japan · Ibiden, Shinko Electric Industries, Ajinomoto, Mitsubishi Electric)*
- [Tokyo Electron Deploys Cryogenic Etch Systems to Challenge US Grip on 3D NAND](https://eastasiabrief.com/semiconductors/tokyo-electron-deploys-cryogenic-etch-systems-challenge-us-grip-36) — The Japanese toolmaker is qualifying high-selectivity dielectric etch platforms across South Korean and Japanese memory lines as 3D NAND architectures surpass… *(August 28, 2026; Semiconductors · Japan · Tokyo Electron, Lam Research, Samsung Electronics, SK hynix, Kioxia Corporation, Micron Technology)*
- [China DRAM Makers Advance Proprietary Vertical Stacking to Counter HBM Export Curbs](https://eastasiabrief.com/semiconductors/china-dram-makers-advance-proprietary-vertical-stacking-counter-hbm-28) — Domestic memory fabricators and packaging houses deploy customized TSV tools and hybrid bonding to build localized high-bandwidth architectures. *(August 28, 2026; Semiconductors · China · ChangXin Memory Technologies, JCET Group, Naura Technology Group)*
- [Naura and SMEE Accelerate Domestic Tool Shipments to Chinese Fabs](https://eastasiabrief.com/semiconductors/naura-smee-accelerate-domestic-tool-shipments-chinese-fabs-22) — Chinese chipmakers expand procurement of domestic etching and lithography tools as foundries push to insulate production lines from export controls. *(August 28, 2026; Semiconductors · China · Naura Technology Group, Shanghai Micro Electronics Equipment, Semiconductor Manufacturing International Corporation, Advanced Micro-Fabrication Equipment Inc. China)*
- [Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target](https://eastasiabrief.com/semiconductors/rapidus-begins-trial-runs-2nm-pilot-line-hokkaido-ahead-15) — Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with domestic equipment makers. *(August 28, 2026; Semiconductors · Japan · Rapidus, Tokyo Electron, Resonac Holdings, IBM)*

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