# East Asia Brief — Winpac

1 briefings mentioning Winpac.

- [SK hynix resumes DRAM packaging outsourcing to vendor Winpac](https://eastasiabrief.com/semiconductors/sk-hynix-resumes-dram-packaging-outsourcing-vendor-winpac-439) — The memory maker is allocating DDR4 and DDR5 flip-chip assembly to the domestic OSAT provider, shifting legacy backend operations outside to reserve cleanroom… *(September 30, 2026; Semiconductors · Korea · SK hynix, Winpac)*

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Publisher: East Asia Brief — https://eastasiabrief.com/