# East Asia Brief — Senic

1 briefings mentioning Senic.

- [East Asian SiC wafer makers shift to laser slicing to cut 8-inch ingot processing loss](https://eastasiabrief.com/analysis/east-asian-sic-wafer-makers-shift-laser-slicing-cut-118) — Slicing and polishing yield disparities across Japan, China and South Korea redefine 200-millimeter silicon carbide substrate economics for automotive device… *(August 30, 2026; Analysis · Global · DISCO Corporation, Mipox Corporation, SICC, TanKeBlue Semiconductor, Senic, SK siltron)*

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Publisher: East Asia Brief — https://eastasiabrief.com/