# East Asia Brief — Rapidus Corporation

3 briefings mentioning Rapidus Corporation.

- [Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips](https://eastasiabrief.com/semiconductors/japan-mask-blank-makers-qualify-high-na-euv-substrates-96) — HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography enters pilot production. *(August 28, 2026; Semiconductors · Japan · HOYA Corporation, AGC Inc., Dai Nippon Printing)*
- [Japan METI allocates clean power grid grants to anchor Hokkaido semiconductor hub](https://eastasiabrief.com/trade-policy/japan-meti-allocates-clean-power-grid-grants-anchor-hokkaido-50) — The Ministry of Economy, Trade and Industry will fund dedicated renewable transmission and substation assets to guarantee zero-carbon electricity for advanced… *(August 28, 2026; Trade & Policy · Japan · Hokkaido Electric Power Co, Rapidus Corporation)*
- [Daifuku expands cleanroom transport backlogs as Asian chipmakers accelerate fab builds](https://eastasiabrief.com/robotics/daifuku-expands-cleanroom-transport-backlogs-asian-chipmakers-accelerate-62) — Surging orders for overhead hoist transport systems across Japanese, Taiwanese, and South Korean wafer fabs lift cleanroom logistics backlogs to multi-year… *(August 28, 2026; Robotics · Japan · Daifuku Co., Ltd.)*

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Publisher: East Asia Brief — https://eastasiabrief.com/