# East Asia Brief — KLA Corporation

1 briefings mentioning KLA Corporation.

- [Kioxia and Sandisk split roadmaps for 3D NAND hybrid bonding in Japan](https://eastasiabrief.com/semiconductors/kioxia-sandisk-split-roadmaps-3d-nand-hybrid-bonding-japan-1114) — The joint venture partners diverge on equipment choices at their shared manufacturing base even as they commit $31 billion to memory capacity through 2032. *(November 4, 2026; Semiconductors · Japan · Kioxia Holdings, Sandisk Corporation)*

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Publisher: East Asia Brief — https://eastasiabrief.com/