# East Asia Brief — Intel

4 briefings mentioning Intel.

- [Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips](https://eastasiabrief.com/semiconductors/japan-mask-blank-makers-qualify-high-na-euv-substrates-96) — HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography enters pilot production. *(August 28, 2026; Semiconductors · Japan · HOYA Corporation, AGC Inc., Dai Nippon Printing)*
- [Japan Expands CMP Slurry Lines for Backside Power](https://eastasiabrief.com/analysis/japan-expands-cmp-slurry-lines-backside-power-68) — Japanese suppliers of chemical mechanical planarization consumables are accelerating capital spending across domestic manufacturing sites to support… *(August 28, 2026; Analysis · Global · Fujibo Holdings, FUJIFILM Corporation, Resonac Holdings)*
- [South Korea funds advanced chip packaging and backside power pilot lines](https://eastasiabrief.com/semiconductors/south-korea-funds-advanced-chip-packaging-backside-power-pilot-66) — The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer architectures for domestic… *(August 28, 2026; Semiconductors · Korea · Samsung Electronics, SK hynix, Hanmi Semiconductor, Hana Micron, Nepes)*
- [Ibiden and Shinko ramp high-layer FC-BGA lines as AI server package sizes expand](https://eastasiabrief.com/semiconductors/ibiden-shinko-ramp-high-layer-fc-bga-lines-ai-43) — Japanese substrate leaders accelerate volume production at new domestic facilities to meet multi-chip packaging demand from global AI accelerator designers. *(August 28, 2026; Semiconductors · Japan · Ibiden, Shinko Electric Industries, Ajinomoto, Mitsubishi Electric)*

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Publisher: East Asia Brief — https://eastasiabrief.com/