# East Asia Brief — ASML

4 briefings mentioning ASML.

- [Japan mask blank makers qualify High-NA EUV substrates for sub-2nm chips](https://eastasiabrief.com/semiconductors/japan-mask-blank-makers-qualify-high-na-euv-substrates-96) — HOYA and AGC accelerate extreme low thermal expansion blank deliveries to foundries and R&D consortia as High-NA EUV lithography enters pilot production. *(August 28, 2026; Semiconductors · Japan · HOYA Corporation, AGC Inc., Dai Nippon Printing)*
- [Rapidus begins trial runs on 2nm pilot line in Hokkaido ahead of 2027 target](https://eastasiabrief.com/semiconductors/rapidus-begins-trial-runs-2nm-pilot-line-hokkaido-ahead-15) — Japan's state-backed foundry venture powers up cleanroom tools in Chitose, testing gate-all-around transistor yields with domestic equipment makers. *(August 28, 2026; Semiconductors · Japan · Rapidus, Tokyo Electron, Resonac Holdings, IBM)*
- [Comparing East Asia Fab Subsidies Across Japan, Korea, and China](https://eastasiabrief.com/analysis/comparing-east-asia-fab-subsidies-across-japan-korea-china-42) — Capital matching rates, cash disbursement mechanisms, and infrastructure funding models diverge sharply across Tokyo, Seoul, and Beijing. *(August 28, 2026; Analysis · Global · TSMC, Samsung Electronics, SK hynix, SMIC, Rapidus)*
- [Japan METI allocates clean power grid grants to anchor Hokkaido semiconductor hub](https://eastasiabrief.com/trade-policy/japan-meti-allocates-clean-power-grid-grants-anchor-hokkaido-50) — The Ministry of Economy, Trade and Industry will fund dedicated renewable transmission and substation assets to guarantee zero-carbon electricity for advanced… *(August 28, 2026; Trade & Policy · Japan · Hokkaido Electric Power Co, Rapidus Corporation)*

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Publisher: East Asia Brief — https://eastasiabrief.com/