# East Asia Brief — Applied Materials

2 briefings mentioning Applied Materials.

- [South Korea funds advanced chip packaging and backside power pilot lines](https://eastasiabrief.com/semiconductors/south-korea-funds-advanced-chip-packaging-backside-power-pilot-66) — The trade ministry establishes dedicated testbeds and research grants to close back-end gaps and scale next-generation wafer architectures for domestic… *(August 28, 2026; Semiconductors · Korea · Samsung Electronics, SK hynix, Hanmi Semiconductor, Hana Micron, Nepes)*
- [Comparing East Asia Fab Subsidies Across Japan, Korea, and China](https://eastasiabrief.com/analysis/comparing-east-asia-fab-subsidies-across-japan-korea-china-42) — Capital matching rates, cash disbursement mechanisms, and infrastructure funding models diverge sharply across Tokyo, Seoul, and Beijing. *(August 28, 2026; Analysis · Global · TSMC, Samsung Electronics, SK hynix, SMIC, Rapidus)*

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Publisher: East Asia Brief — https://eastasiabrief.com/